干法蚀刻系统
Dry Decapper ES 312是以反应性离子气体为主导，对集成电路等电子元器件上的树脂进行解封的优良系统。
We can promise the Efficient Dry Decapsulation for 3 samples at once by Automatic Matching and N2 gas regular blowing for residue.
Automatic Operation up to the end of Decap
Max 3 samples at once
High Repeatability Etching
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